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Intel and Altera widen chip manufacturing agreement

26
Mar
2014

By Noel Randewich SAN FRANCISCO (Reuters) – Chipmaker Altera Corp is working with Intel Corp to combine separate components like processors, memory and programmable chips into customized devices in a technique aimed at reducing manufacturing costs and improving performance. The new venture, to produce what are known in the technology world as ‘multi-die’ devices, builds on an agreement announced over a year ago for Intel to open its cutting-edge factories to produce Altera’s programmable chips, Brad Howe, Altera’s senior vice president of research and development, told Reuters late on Tuesday. It also reflects strategy at Intel, the world’s largest chipmaker, to look for growth opportunities in mobile devices, reducing the company’s reliance on the slowing personal computer industry. Both companies are contributing packaging and semiconductor expertise that will help Altera improve the performance of chips for communications, high-performance computing and military applications.

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