The Latest in IT Security

Amazon’s ‘Fire’ smartphone contains chips from Qualcomm, Samsung, NXP

25
Jul
2014

By Noel Randewich SAN FRANCISCO (Reuters) – Amazon.com Incs new Fire smartphone contains chips from Qualcomm Inc, NXP Semiconductors NV, and Samsung Electronics Co Ltd, according to repair and teardown specialists iFixit, which pried one open on Thursday. The Fire phone also houses chips from Synaptics Inc and Skyworks Solutions Inc, said the repair outfit, which made a name for itself taking apart devices like Apple Incs iPhone and identifying its internal components.

Comments are closed.

Categories

SUNDAY, SEPTEMBER 22, 2019
WHITE PAPERS

Mission-Critical Broadband – Why Governments Should Partner with Commercial Operators:
Many governments embrace mobile network operator (MNO) networks as ...

ARA at Scale: How to Choose a Solution That Grows With Your Needs:
Application release automation (ARA) tools enable best practices in...

The Multi-Model Database:
Part of the “new normal” where data and cloud applications are ...

Featured

Archives

Latest Comments

Social Networks